FreePCB project report (default units = MIL)
============================================
Project name: DSOscope_USBBrd_A03
Project file: C:\Users\pmesser\_Paul\Design\DSOscope\PCB\A03\DSOscope_USBBrd_A03.fpc
Default library folder: c:\users\pmesser\_paul\design\my_freepcb_library

Board statistics
==============
Number of copper layers: 4
Number of board outlines: 1
Board outline(s) extent: X = 1150 MIL; Y = 925 MIL
Number of parts: 18
Number of pins: 66 (6 through-hole, 60 SMT)
Number of vias: 19
Number of holes: 25

Drill list
==========
NUMBER  DIAMETER
------  --------
   19   21 MIL
    6   41 MIL

Part list
=========
For parts on top: the angle is in degrees CCW, as viewed from the top
For parts on the bottom: the angle is in degrees CCW, as viewed from the bottom by flipping the PCB left-right
All centroid coordinates are as viewed from the top

REF         PACKAGE  VALUE       FOOTPRINT  PINS  HOLES    SIDE  ANGLE  CENT X  CENT Y  PIN1 X  PIN1 Y  GLUE W  GLUE X  GLUE Y
---         -------  -----       ---------  ----  -----    ----  -----  ------  ------  ------  ------  ------  ------  ------
 C1            0805                   0805     2      0     top    180     815     535     770     535      10     815     580
 C2            0805                   0805     2      0     top    270      80     420      80     465      10     125     420
 C3            0805                   0805     2      0  bottom      0     385     575     430     575      10     385     620
 D1       1206DIODE              1206DIODE     2      0     top      0   182.5     825     250     825      10   182.5   757.5
 D2       1206DIODE              1206DIODE     2      0     top    180   457.5     825     390     825      10   457.5   892.5
 L1            0805                   0805     2      0     top    180     815     455     770     455      10     815     500
 P1  SqPinSocket1x6         SqPinSocket1x6     6      6  bottom     90    1000     325    1000     325
 R1            0805                   0805     2      0     top     90     100     650     100     605      10      55     650
R10            0805                   0805     2      0  bottom      0     165      85     210      85      10     165     130
 R2            0805                   0805     2      0     top      0     705     825     750     825      10     705     780
 R3            0805                   0805     2      0     top      0     735     245     780     245      10     735     200
 R4            0805                   0805     2      0     top      0     735     165     780     165      10     735     120
 R5            0805                   0805     2      0     top      0     555      85     600      85      10     555      40
 R6            0805                   0805     2      0     top    180     175      85     130      85      10     175     130
 R7            0805                   0805     2      0  bottom    180     745     245     700     245      10     745     200
 R8            0805                   0805     2      0  bottom    180     745     165     700     165      10     745     120
 R9            0805                   0805     2      0  bottom    180     565      85     520      85      10     565      40
 U1          SSOP28                 SSOP28    28      0     top    180     369   422.5     200     255      25     369   422.5

Gerber file settings
====================
Include board outline: YES
Include moires: NO
Include layer description text: NO
Include pilot holes: YES
Connect SMT pins to copper areas: NO
Use thermals for SMT pins: YES
Use thermals for through-hole pins: YES
Use thermals for vias: YES
Make solder-mask cutouts for vias: NO
Use 90-degree thermals for round pins: NO
Copper to copper-fill clearance: 15 MIL
Hole-edge to copper-fill clearance: 15 MIL
Solder mask clearance: 8 MIL
Pilot hole diameter: 10 MIL
Minimum silkscreen line width: 5 MIL
Thermal relief line width: 20 MIL
Board outline line width: 5 MIL
Minimum annular ring width (pins): 7 MIL
Minimum annular ring width (vias): 5 MIL
Amount to shrink SMT pads for paste mask: 0 MIL

DRC settings
============
Minimum trace width: 10 MIL
Minimum pad to pad clearance: 10 MIL
Minimum pad to trace clearance: 10 MIL
Minimum trace to trace clearance: 10 MIL
Minimum hole to copper clearance: 15 MIL
Minimum hole to hole clearance: 25 MIL
Minimum annular ring (pins): 7 MIL
Minimum annular ring (vias): 5 MIL
Minimum board edge to copper clearance: 25 MIL
Minimum board edge to hole clearance: 25 MIL
Minimum copper area to copper area clearance: 10 MIL
